Hangxing Liu receives SSCS Student Travel Grant Award

Hangxing has been selected by the IEEE Solid-State Circuits Society (SSCS) to receive the Student Travel Grant Award (STGA) to attend the International Solid-State Circuits Conference (ISSCC) 2025.

25.11.2024

Read
Number of comments

The SSCS will also feature Hangxing's achievement in the Spring 2025 issue of the IEEE Solid-State Circuits Magazine and on its website. Congratulations Hangxing !